solder paste造句

• 6 is the sequence of solder paste height measurements defined
  锡膏厚度的测量顺序是否指定
• Soldering pastes - part 1 : composition , technical specifications
  焊剂.第1部分:成分和技术规范
• Reflow solder paste in 2 hours as soon as possible after printing
  印刷后要在2小时内回流焊膏。
• The operator should use the solder paste quickly after it has been taken out
  取出的锡膏要尽快实施印刷使用。
• 7 is the average and range of solder paste height measurements spc controlled
  锡膏厚度测量的平均值和间距spc是否受控
• Requirements for soldering paste
  焊膏要求
• Familiar with lead - free solder paste and at least 3 years related sales experience
  熟悉无铅锡膏产品及市场，具备3年以上行业销售经验。
• To achieve the required bump heights , the solder paste is over - printed onto the wafer bond pads
  为了获得要求的凸起高度，锡膏在晶片焊盘过焊。
• 8 are lcd ' s and ucla ' s defined for the average and range of solder paste measurements
  对锡膏厚度测量的平均值和间距是否定义了其控制上限和下限
• On the other hand it is a wrong way of opening the cover frequently or not covering the solder paste
  不要取一点用一点，频繁开盖或始终将盖子敞开着。
• 9 is the upper and lower specification limits for individual solder paste height measurements also defined
  单点锡膏厚度测量是否定义了其控制上限和下限
• Solder paste , screen printing , use ways , printing process course will decide the printing quality
  在锡膏印刷工艺中，锡膏、丝印机、锡膏使用方法和印刷工艺过程将影响到印刷质量。
• In this process , a standard stencil printing technique is used to print solder paste directly onto silicon wafers ( figure 4 )
  在这个过程，标准印刷技术用来把锡膏直接印刷到硅晶片上。
• Figure 5 . transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co - planarity
  图5 ，锡高转移的效率与孔面积比率及它对回流峰共面度的影响。
• Lf305a is designed for widely electronic assembly applications . it is a lead - free , mildly active solder paste
  Lf305a这种材料的设计被广泛应用于电子零件的装配.它是一种无铅,低活性硬质糊状物
• We should judge the adhibit of solder paste before screen printing by automatic machine or by hand
  我们在进行锡膏印刷前应对锡膏进行一定的检测。如果没有专用设备也可以用以下的方法检查一下。
• Solder paste is applying for the connection between the mount components foot and pcb pads in the smt assembly
  在表面贴装装配的回流焊接中，锡膏用于表面贴装元件的引脚或端子与焊盘之间的连接。
• Attachment materials for electronic assembly - requirements for solder pastes for high - quality interconnections in electronic assembly
  电子组件用的连接材料.电子组件中的优质互连接器用固体涂胶
• More than 3 years working experiences in smt processing and strong willing to be a technical sales in selling lead - free solder paste
  3年以上smt生产线工艺制程控制经验，具有销售无铅锡膏产品的愿望。
• More than 5 years working experiences in smt process . familiar with technical , equipment , process of lead - free solder paste
  5年以上smt锡膏制程工作背景,熟悉无铅锡膏产品技术及生产工艺、设备、制程者。